HBMX ETF Review 2026: Tuttle Capital Concentrated Memory Stack ETF
June 20, 2026 · 8 min read
HBMX launched June 2, 2026 as a concentrated 20–35 stock bet on the memory semiconductor stack — DRAM, NAND, high-bandwidth memory (HBM), advanced packaging, and the test equipment that makes it all work. Here is whether it belongs in your portfolio.
HBMX at a glance
Full nameTuttle Capital Concentrated Memory Stack ETF
Ticker / ExchangeHBMX / Cboe
Inception dateJune 2, 2026very new — limited track record
Expense ratio0.95%higher than index ETFs; actively managed
Portfolio size20–35 holdingsconcentrated — by design
Investment requirement≥25% memory-related revenueor substantial strategic focus on memory
ManagementTuttle Capital Managementknown for thematic concentrated ETFs (also runs FOTO)
What the memory stack is — and why it matters for AI
Every AI training run requires massive amounts of high-bandwidth memory (HBM) chips stacked directly next to the GPU. An NVIDIA H100 GPU uses 80GB of HBM3, a B200 uses 192GB of HBM3e — and hyperscalers are ordering tens of thousands of these accelerators at a time.
The memory semiconductor ecosystem HBMX targets includes:
DRAM manufacturers (Micron, SK Hynix, Samsung) — the raw memory chips
NAND flash suppliers — storage that feeds inference pipelines
Semiconductor test equipment (Advantest, Onto Innovation, Camtek) — every HBM chip is tested before shipping
Wafer fab equipment (Applied Materials, Lam Research, ASML) — manufacturing the chips requires the most advanced lithography and etch tools
The concentration is the point. Most broad semiconductor ETFs (SOXX, SMH) dilute the memory theme across logic chips, CPUs, and networking. HBMX concentrates specifically on the stack that powers AI memory.
Top holdings (as of June 16, 2026)
Company
Ticker
Weight
Role in Memory Stack
Onto Innovation
ONTO
8.64%
Wafer inspection & metrology
Micron Technology
MU
8.33%
DRAM & NAND manufacturer; HBM rising
Advantest
ATEYY
7.39%
Memory test equipment (HBM, DRAM)
Applied Materials
AMAT
6.86%
CVD, ALD, PVD equipment for DRAM/NAND
Amkor Technology
AMKR
6.02%
Advanced packaging (HBM, 2.5D/3D)
ASML Holding
ASML
5.76%
EUV lithography for leading-edge DRAM
Lam Research
LRCX
5.64%
Etch & deposition for NAND
Camtek
CAMT
5.63%
Inspection for advanced packaging & HBM
The portfolio spans the entire stack from equipment (ASML, AMAT, LRCX) → manufacturing (MU) → packaging (AMKR) → test (ONTO, ADNT, CAMT). No single tier dominates — the fund spreads risk across the value chain.
The AI memory demand story
HBM is the defining bottleneck of the current AI compute cycle. GPU manufacturers cannot just add more CUDA cores — training large language models is fundamentally memory-bandwidth-constrained. The industry response is HBM: DRAM chips stacked 8–12 layers high using through-silicon vias, delivering 10x the bandwidth of standard DRAM per watt.
SK Hynix has a 2+ year HBM lead — but Micron is ramping HBM3e aggressively and gaining share
Samsung's HBM qualification delays for NVIDIA created a windfall for SK Hynix and Micron in 2024–2025
HBM pricing has held firm at significant premium to commodity DRAM — $25–30/GB vs $3–4/GB for DDR5 — sustaining memory maker margins
NAND: AI inference requires fast storage for KV-cache retrieval; enterprise SSD demand tracking AI workload growth
Test intensity: HBM chips require significantly more test coverage per die than commodity DRAM, driving Advantest and Onto Innovation's outperformance
Bull case vs bear case for HBMX
Bull case:
AI capital expenditure by hyperscalers (Microsoft, Google, Meta, Amazon) remains on an upward trajectory through 2027–2028 — each new data center needs more HBM
HBM3e → HBM4 transition drives an upgrade cycle in packaging and test equipment in 2026–2027
Micron catching SK Hynix in HBM market share creates a duopoly with pricing discipline — high margins sustained
Concentrated portfolio means outperformance can be significant when the memory cycle is up
Bear case:
Semiconductor cycles are severe — 2022–2023 saw HBM precursors (standard DRAM) fall 50%+; a repeat would hurt the whole portfolio
0.95% expense ratio is expensive; over a decade it compounds to meaningful performance drag vs SOXX or SMH at 0.35–0.44%
Concentration risk: 8 positions = 60% of the fund. One bad earnings report from Micron or Onto can hit the fund hard
New ETF (June 2026) — no track record; the fund must prove it can survive a downcycle
China export controls on semiconductor equipment (ASML, AMAT, LRCX) remain a policy risk
Who should buy HBMX?
Investors who want focused memory semiconductor exposure beyond owning MU alone
Those who believe AI infrastructure buildout continues for 3–5 years and want the picks-and-shovels play
Tactical traders looking to express a HBM or AI capex thesis in a single ticker
NOT right for passive, low-cost, long-horizon investors — the 0.95% fee and concentration are a mismatch
Best used as a satellite position (5–15% of a portfolio) rather than a core holding
HBMX vs alternatives
SOXXiShares Semiconductor ETF
ER: 0.35%
Broader 30 holdings; memory is ~20% of fund
SMHVanEck Semiconductor ETF
ER: 0.35%
NVDA is 20%+ — more GPU than memory
MUMicron Technology (direct)
ER: 0%
Pure DRAM/NAND/HBM play but single stock risk
HBMXTuttle Memory Stack ETF
ER: 0.95%
Concentrated across full memory stack — packaging + test included